We’re excited to connect with customers and partners at upcoming TSMC 2026 China Technology Symposium
Date: June 25, 2026
Shanghai, China
Visit us at our booth to learn more about:
3nm 224G PAM4 / 64G NRZ silicon photonics TIA & Driver IP — enabling AI-era scale-up and scale-out networks.
3nm 64 GS/s ADC IP — purpose-built for high-speed AI data centre infrastructure.
16nm 16G UCIe IP — delivering high-bandwidth die-to-die connectivity.
Chiplet & droplet engagements — going beyond IP to offer full chiplet/droplet products for complete, end-to-end solutions.
