SAN JOSE, California – March 14th, 2024 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, announced that it will attend and have a booth at the TSMC 2024 North America Technology Symposium 24th April, 2024 in Santa Clara, California. Please contact us if you would like to schedule a meeting.
About Omni Design Technologies
Omni Design Technologies is a leading provider of high-performance, ultra-low power IPs, from 28nm down through advanced FinFET nodes, which enable differentiated system-on-chip (SoC), in applications ranging from 5G, wireline and optical communications, LiDAR, radar, automotive networking, AI, image sensors, and the internet-of-things (IoT). Our Swift™ ADC and DAC data converter IPs range from 6-bit to 14-bit resolution and from a few MSPS to more than 100 GSPS sampling rates. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with five additional design centers globally.