Omni Design Technologies to Exhibit at TSMC 2023 China Technology Symposium

Date: June 21, 2023 (Wednesday)                             Time: 9:00a.m. – 4:00p.m.

Venue: Shanghai International Convention Center (SHICC)

No.2727, Riverside Avenue, Pudong, Shanghai 200120, China

Join us at the TSMC 2023 China Technology Symposium to discuss high-performance analog-digital data conversion and analog front end design, and how Omni Design can meet your challenging system requirements.


Omni Design Technologies provides the best-in-class Analog to Digital, Digital to Analog Converters and Analog Front Ends, which are built on TSMC’s leading process technologies. They are fundamental building blocks necessary for many of the current high growth semiconductor markets.

The Omni Design team will showcase its latest IP solutions at this year’s TSMC Technology Symposium and discuss how customers can leverage TSMC’s technology innovations with Omni Design’s cutting-edge analog mixed-signal designs. 


Omni Design Technologies, Inc.

About Omni Design Technologies

Omni Design Technologies is a leading provider of high-performance, ultra-low power IP cores, from 28nm down through advanced FinFET nodes, which enable differentiated system-on-chip (SoC), in applications ranging from 5G, wireline and optical communications, LiDAR, radar, automotive networking, AI, image sensors, and the internet-of-things (IoT). Our data converter (ADC and DAC) IP cores range from 6-bit to 14-bit resolution and from a few Msps to more than 7 Gsps sampling rates with more than 100 Gsps sampling rates in development. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas, California with additional design centers in Fort Collins-Colorado, Bangalore-India, Bangalore-Hyderabad, Dublin-Ireland, Boston-Massachusetts, Hyderabad-India.