Omni Design Technologies, Inc. will be presenting its latest groundbreaking mixed-signal embedded IP cores at the TSMC 2019 Open Innovation (OIP) Ecosystem Forum to be held in Santa Clara, California on September 26, 2019.
Please visit us at Omni Design Technologies Booth # 904 and meet with the Omni team and learn more about our company.
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About Omni Design Technologies:
Omni Design Technologies (https://www.omnidesigntech.com) designs and develops the world’s highest-performance ultra-low power embedded IP cores by leveraging our revolutionary and proprietary SWIFT™ circuit technology. Omni’s mission is to provide a wide range of disruptive ultra-low-power, high-performance embedded circuits that enable advanced systems applications, including 5G wireless communications, automotive ethernet, and automotive LIDAR. Omni is staffed by semiconductor industry veterans, world class technologists from MIT, and experienced entrepreneurs.